Apple Explores Indian Chipmakers Tie-ups for iPhone Component Packaging

Apple is exploring the possibility of assembling and packaging select iPhone components in India, marking a potential shift in its global supply chain strategy, according to The Economic Times report. 

Early Discussions with Indian Chipmakers  

Apple is in preliminary talks with Indian semiconductor firms to assemble and package certain iPhone components. This would be the first instance of Apple considering chip assembly and packaging within India.  

While the specific components have not been confirmed, the report indicated that display-related chips could be among those handled at a proposed facility in Sanand, Gujarat. 

Apple has been working towards increasing iPhone manufacturing in India, with an aim to produce the majority of US-bound devices there by the end of 2026.  

Engagement With CG Semi and Industry Response 

The discussions reportedly involve Murugappa Group-owned CG Semi, which is setting up an outsourced semiconductor assembly and test (OSAT) plant in Sanand.  

This acceleration is partly driven by efforts to reduce exposure to China amid tariff uncertainties. In April, the US imposed 26% duties on Indian imports, significantly lower than the tariffs applied to Chinese goods at the time, although most duties have since been temporarily paused except those on China. 

Read More: Apple’s India iPhone Exports Hit Record $2 Billion in November! 

Conclusion  

The discussions highlight Apple’s broader strategy to diversify manufacturing away from China and strengthen India’s role in its global supply chain. While talks remain at an early stage and details are unconfirmed, any move towards local chip packaging would reinforce India’s growing importance in high-value electronics manufacturing.

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