Paras Defence and Space Technologies Limited has announced the incorporation of a new subsidiary, Paras Semiconductors Private Limited. This strategic move aims to expand the company's footprint in the semiconductor industry, focusing on advanced packaging solutions.
The Board of Directors of Paras Defence approved the incorporation of Paras Semiconductors Private Limited during their meeting on January 19, 2026.
The subsidiary will specialise in state-of-the-art advanced heterogeneous packaging and 3D packaging OSAT (Outsourced Semiconductor Assembly and Testing). The focus areas include AI, high-performance computing (HPC), networking, and data centre applications.
The proposed authorised share capital for Paras Semiconductors is ₹10,00,000, divided into 1,00,000 equity shares of ₹10 each. Similarly, the proposed paid-up share capital is also ₹10,00,000, divided into 1,00,000 equity shares of ₹10 each.
Paras Defence will subscribe to 70,000 equity shares of ₹10 each, amounting to ₹7,00,000. This investment will give Paras Defence a 70% stake in the new subsidiary.
The investment does not fall under related party transactions for Paras Defence, but post-investment, the subsidiary will be considered a related party.
Read More: India Plans Easier FDI Rules For Defence Sector to Enable Majority Foreign Ownership!
The new subsidiary will operate in the semiconductor industry, a sector known for its rapid technological advancements and significant impact on various applications.
The primary objective of Paras Semiconductors is to establish a robust presence in the semiconductor packaging domain, catering to AI, HPC, networking, and data centre applications.
As of January 19, 2026, at 11:18 AM, Paras Defence and Space Technologies share price on NSE was trading at ₹657.85 down by 0.66% from the previous closing price.
Paras Defence's decision to establish Paras Semiconductors marks a significant step in diversifying its business operations. By venturing into the semiconductor industry, the company aims to leverage its expertise and resources to tap into emerging opportunities in advanced packaging and AI-driven applications.
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Published on: Jan 19, 2026, 1:20 PM IST

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