Vinyas Innovative Technologies

Vinyas Innovative Technologies Limited was incorporated on April 27, 2001 as a Private Company with Registrar of Companies, Bangalore. Subsequently, the Company was converted into Public Limited Company dated June 14, 2023. The Company is a leading provider of design, engineering and electronics manufacturing services catering to global Original Equipment Manufacturers and Original Design Manufacturers in Electronic Industry. With wide industry knowledge, cutting-edge technologies & state-of-the-art infrastructure, it support Global partners from conceptualizing the design, engineering, manufacturing to turnkey requirements for mission-critical applications. The Company is a preferred IOP for foreign OEMs for executing defence manufacturing projects. The Electronic Manufacturing Services are provided as Build to Print (B2P) and Build to Specification (B2S) services to clients. The solutions primarily comprise: (i) Printed Circuit Board Assembly (PCBA), and (ii) complete box builds used in safety critical systems such as cockpits, inflight systems, landing systems, and medical diagnostic equipment. In B2P solutions, the Company provide agile and flexible manufacturing services. B2S services design the relevant product based on the specifications provided by the client and manufacturing the product. The Company launched its initial public offering (IPO) of 33,12,800 equity shares, each with a face value of Rs 10 by raising funds aggregating to Rs 54.67 Crores in October, 2023 during FY2023-24. The Company launched a wiring harness and product integration at Mysore in FY 2025. It commissioned advanced assembly technologies into high precision electronic manufacturing during the year. The Company incorporated Vinyas Innovative Technologies Inc., USA, as a wholly owned subsidiary to expand the presence in the United States on February 3, 2026. It further incorporated Vinyas Technologies Private Limited as its wholly owned subsidiary for domestic business. It commenced the expansion of an additional 25,000 sq. ft. Class 3 manufacturing facility in 2026.