Paras Defence and Space Technologies Limited (PARAS) has incorporated a new subsidiary, Paras Semiconductors Private Limited, to expand its capabilities in advanced semiconductor packaging and testing.
Paras Semiconductors Private Limited was incorporated on February 27, 2026, in India. The company operates in the semiconductor industry and is positioned to develop state of the Art heterogeneous and 3D packaging solutions for AI, high performance computing, networking and data centre applications.
PARAS is the holding company of the new subsidiary and holds 70% of the equity shares. The initial subscription comprises 70,000 equity shares of ₹10 each, amounting to a total capital of ₹7,00,000, which has been paid entirely in cash.
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The subsidiary aims to provide outsourced semiconductor assembly and testing services, targeting sectors that require high‑density, high‑speed packaging solutions. Its focus on AI and HPC aligns with growing demand for advanced data processing capabilities.
The incorporation complies with Regulation 30 of SEBI Listing Regulations and relevant SEBI circulars issued in November 2024 and January 2026. No additional governmental approvals were required for the formation of the subsidiary.
As of February 27, 2026, at 3:30 PM, Paras Defence and Space Technologies share price on NSE was trading at ₹637.80 up by 0.12% from the previous closing price.
Paras Defence's establishment of Paras Semiconductors Private Limited adds a specialised semiconductor packaging arm to its portfolio, with a capital base of ₹7,00,000 and a 70% shareholding by the parent company.
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Published on: Feb 28, 2026, 9:22 AM IST

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