Paras Defence and Space Technologies Shares in Focus as Its Subsidiary Signs MoU for OSAT Facility in Madhya Pradesh

Paras Semiconductors Private Limited, a subsidiary of Paras Defence and Space Technologies Limited, has signed a Memorandum of Understanding (MoU) with the Department of Science and Technology, acting through the MP State Electronics Development Corporation (MPSeDC), as per the exchange filings. 

The collaboration aims to facilitate the establishment of a greenfield advanced IC packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in Madhya Pradesh.  

₹6,200 Crore Investment Planned 

Under the proposed project, Paras Semiconductors will set up the new facility in the Indore-Ujjain region of Madhya Pradesh. 

The company plans to invest approximately ₹6,200 crore in developing the advanced semiconductor packaging facility.  

Facility to Support Advanced Packaging 

The proposed OSAT facility will undertake a range of advanced semiconductor packaging operations. 

These include 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing and reliability.  

Collaboration with MPSeDC 

Paras Semiconductors and MPSeDC will combine their expertise and resources to support the development of advanced semiconductor manufacturing infrastructure in the state. 

The partnership is intended to facilitate the establishment of a domestic advanced IC packaging and OSAT ecosystem in Madhya Pradesh.  

Read More: India Semiconductor Mission 2.0: Government to Co-Invest in Chip Startups to Help Them Scale Globally! 

Paras Defence and Space Technologies Share Price Performance  

As of 22 July 2026, at 11:30 AM, Paras Defence and Space Technologies Limited share price was trading at ₹1,227.60 per share, reflecting a surge of 0.41% from the previous trading session. 

Conclusion 

The MoU marks a step towards establishing a large-scale semiconductor packaging facility in Madhya Pradesh through a collaboration between Paras Semiconductors and MPSeDC. The proposed investment of ₹6,200 crore is aimed at developing advanced IC packaging and OSAT capabilities in the state.  

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