Amkor Technology, Inc. Equity-NMS: AMKR

Technology

Semiconductors

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Previous close :

$26.03

52W high :

$31.38

1Y :

10.77%

5Y :

147.58%

EPS(TTM): :

3.11

Shares O/S :

245.28 M

Market cap :

6.24 B

What is the share price of Amkor Technology, Inc. today?

Amkor Technology, Inc. (AMKR) share price as of March 23, 2023, is $26.03. If you are investing from India, you can always check the valuation in the INR before investing.

Can Indian Investors purchase shares of Amkor Technology, Inc.?

Yes, Indian Investors can invest in the Amkor Technology, Inc. (AMKR) Share by opening an international trading account with Angel One.

How can I purchase Amkor Technology, Inc. shares in India?

Purchasing Amkor Technology, Inc. (AMKR) share from India can be done by:

Directly: By opening an international trading account with Angel One. The process would include KYC verification.
The account activation takes a few minutes to a few hours, after which you can start buying Amkor Technology, Inc. (AMKR) by making deposits in US dollars.
Indirectly: By investing in mutual funds and Exchange Traded Funds (ETF) that offers exposure in global stocks.

Can I buy Fractional shares of Amkor Technology, Inc.?

Yes, you can purchase fractional shares of Amkor Technology, Inc. (AMKR) or any other US company shares in Angel One for any dollar amount.

What is the market capitalization value of Amkor Technology, Inc.?

The market capitalization of Amkor Technology, Inc. on March 23, 2023, is $6.25 B.

In which sector Amkor Technology, Inc. belongs?

Amkor Technology, Inc. operates in the Technology sector, specifically in the Semiconductors industry.

What documents are required to invest in Amkor Technology, Inc. stocks?

In order to invest in Amkor Technology, Inc. (AMKR) you will need Proof of Identification (Aadhaar, PAN, Passport etc.) and Proof of Address (Aadhaar, Voter Card etc.)

From start to end, the process is digital and can be seamless.

Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip-specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. It refers to its flip chip, wafer-level processing and related test services as Advanced Products, and its wirebond packaging, power device packaging and related test services as Mainstream Products. Its Advanced Products include flip chip scale packages, wafer-level packages, and flip chip ball grid array (FCBGA) packages. Its Mainstream Products include leadframe packages, substrate-based wirebond packages, and micro-electro-mechanical systems (MEMS) packages.